▪ Support Wear-leveling
▪ Support TRIM command
▪ Management of sudden power-fails
▪ Support Bad Blocks management
▪ Support S.M.A.R.T. function
▪ Water-proof, Dust-proof
▪ Internal FUSE (Option)
▪ SIP Module Solution
Specification
Interface
SD3.0, Embestor
Flash Type
SLC (W.T.) & sMLC (W./E.T) & MLC (W./E.T) Flash
Capacity
4GB~ 32GB
Max. Performance
Read: 90MB/s, Write: 70MB/s
Operating Voltage
2.7V~3.6V
Power Consumption
0.55W
Operating Temp.
-20°C ~ + 85°C (E.T)
-40°C ~ + 85°C (W.T)
Storage Temp.
-25°C ~ + 90°C (E.T)
-50°C ~ + 95°C (W.T)
Humidity
0%~95%(SLC)
5%~95%(sMLC, MLC)
Shock
Duration: 0.5ms, 1500G,3 axes
Vibration
30G Peak, 10Hz to 2K Hz, 3 axes
MTBF
2,000,000 hrs
Dimensions
32mm x 24mm x 2.1mm
Feature
▪ Support Wear-leveling
▪ Support TRIM command
▪ Management of sudden power-fails
▪ Support Bad Blocks management
▪ Support S.M.A.R.T. function
▪ Water-proof, Dust-proof
▪ Internal FUSE (Option)
▪ SIP Module Solution
